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3-Channel Headset Microphone EMI Filter with ESD Protection CSPEMI205G
Features
* * * Three channels of EMI filtering, two for earpiece speakers and one for a microphone Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Chip Scale Package features extremely low parasitic inductance for optimum filter performance Greater than 30dB relative attenuation in the 8002700MHz range +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) 8-bump, 1.41mm X 1.430mm footprint Chip Scale Package (CSP) RoHS compliant (lead-free) finishing
Product Description
The CSPEMI205G is a low-pass filter array integrating three pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains two different filter values. Each high quality filter provides more than 30dB attenuation in the 800-2700 MHz range. These pistyle filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CSPEMI205G provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CSPEMI205G is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI205G is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing.
* * * * *
Applications
* * * * * * EMI filtering and ESD protection for headset microphone and speaker Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders
(c)2010 SCILLC. All rights reserved. April 2010 Rev. 3
Publication Order Number: CSPEMI205G/D
CSPEMI205G
Electrical Schematic
Rev. 3 | Page 2 of 9 | www.onsemi.com
CSPEMI205G
PIN DESCRIPTIONS
PIN A1 A3 A5 B2 B4 C1 C3 C5 NAME EAR1_IN EAR2_IN MIC_IN GND GND EAR1_OUT EAR2_OUT MIC_OUT DESCRIPTION Earpiece Input 1 (from audio circuitry) Earpiece Input 2 (from audio circuitry) Microphone Input (from microphone) Device Ground Device Ground Earpiece Output 1 (to earpiece) Earpiece Output 2 (to earpiece) Microphone Output (to audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Bumps 8 Package CSP Ordering Part Number CSPEMI205G
1
Part Marking AF
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW
Rev. 3 | Page 3 of 9 | www.onsemi.com
CSPEMI205G
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL R1 R2 C1 C2 ILEAK VSIG PARAMETER Resistance Resistance Capacitance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 5 Cut-off frequency 2; Note 5 VIN=5.0V ILOAD = 10mA 5 -15 Notes 2 and 4 15 8 Notes 2,3 and 4 CONDITIONS MIN 9 54 80 38
(NOTE 1)
TYP 10 68 100 47
MAX 11 75 120 57 1.0
UNITS pF pF A
7 -10
15 -5
V V
VESD
kV kV
VCL
+15 -19 R = 10, C = 100pF R = 68, C = 47pF 34 63
V V MHz MHz
fC1 fC2
Note 1: TA=25 unless otherwise specified. C Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Note 5: ZSOURCE=50, ZLOAD=50
Rev. 3 | Page 4 of 9 | www.onsemi.com
CSPEMI205G
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Earpiece Circuit (A3-C3) EMI Filter Performance
Rev. 3 | Page 5 of 9 | www.onsemi.com
CSPEMI205G
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. Microphone Circuit (A5-C5) EMI Filter Performance
Rev. 3 | Page 6 of 9 | www.onsemi.com
CSPEMI205G
Application Information
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260 C
N on-Solder M ask D efined Pad 0.240m D m IA.
Solder Stencil Opening 0.300m D m IA.
Solder Mask Opening 0.290m D m IA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 7 of 9 | www.onsemi.com
CSPEMI205G
Mechanical Details
CSP Mechanical Specifications The CSPEMI205G is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD's chip scale packaging, see the California Micro Devices CSP Package Information document.
D2 0.355 0.380 0.405 0.0140 0.0150 0.0160 3500 pieces
PACKAGE DIMENSIONS
Package Bumps Dim Millimeters Min A1 A2 B1 B2 B3 B4 C1 C2 D1 Nom Max Min Custom CSP 8 Inches Nom Max
# per tape and reel
Controlling dimension: millimeters
BOTTOM VIEW
A1
1.385 1.430 1.475 0.0545 0.0563 0.0581 1.365 1.410 1.455 0.0537 0.0555 0.0573
C1 B1 C B4 B3
SIDE VIEW
0.495 0.500 0.505 0.0195 0.0197 0.0199
B A2
0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.165 0.215 0.265 0.0065 0.0085 0.0104 0.220 0.270 0.320 0.0087 0.0106 0.0126 0.561 0.605 0.649 0.0221 0.0238 0.0256
A 12345 C2
0.30 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS
D1 D2
Package Dimensions for CSPEMI205G Chip Scale Package
Rev. 3 | Page 8 of 9 | www.onsemi.com
CSPEMI205G
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 1.55 x 1.52 x 0.71 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
PART NUMBER CSPEMI205G
CHIP SIZE (mm) 1.43 x 1.41 x 0.605
P0 4mm
P1 4mm
+
+
+
Figure 6. Tape and Reel Mechanical Data
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
INFORMATION PUBLICATION ORDERING INFORMATION
FULFILLMENT: LITERATURE FULFILLMENT Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: Phone 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: Fax 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: Email orderlit@onsemi.com Support: N. American Technical Support 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
Rev. 3 | Page 9 of 9 | www.onsemi.com

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